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Next, a metalized plastic lid equipped with a climate-control feature is laminated over the chips for protection. For RF input and output connections up to 100 GHz the lid provides either built-in antennas or waveguide transitions. The Multilithic Microsystems™ (MLMS™) technology uses flip-chip and electromagnetic coupling methods to minimize expensive semiconductor real estate while eliminating lengthy interconnects and their related variability [41–43]. MLMS™ moves passive circuitry onto an inexpensive proprietary substrate that processes with the ease of silicon, yet works past 100 GHz.

This includes MMIC technologies, metal housings, and MCMs. More details are available elsewhere in references [15–18] or Chapter 4. 1 MMICs Strictly speaking, a MMIC is not a packaging technology. In fact, MMIC technologies are an extension of the IC concept for microwave applications [20]. It refers to a combination of interconnected microwave circuit elements monolithically integrated on a single substrate. The package of a MMIC may be a metal housing or a plastic encapsulation, as will be seen later.

Caution therefore needs to be taken to ensure sufficient bypassing of the out-of-package capacitors, which have to complement the on-chip bypass capacitors through the wire-bond inductance. 2 Chip-on-board at mmWaves Strictly speaking, COB or direct chip attach (DCA) devices are non-packaged devices. The bare die is supplied without a package and is attached, with conductive epoxy glue, for instance, directly to a PCB. These devices require a specific process for assembly, where the chip is wire-bonded to the board first and then protected from mechanical damage and contamination by an epoxy ‘glob-top’.

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