By Charles Pfeil
This booklet is for PCB designers who're designing forums with a number of very huge Ball Grid Array (BGA) programs. It explores the impression of dense BGAs with excessive pin-count on PCB layout and gives ideas for the inherent layout demanding situations. even though you could no longer but were faced with the problems of routing BGAs and the impression on fabrication expenditures and sign integrity, this publication will display those capability pitfalls in addition to tips on how to mitigate those difficulties
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Extra resources for BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs
On some of the largest PCBs, there are well over ten thousand nets to route. To control crosstalk, increase the spacing between traces which requires more layers. Also consider running the differential pairs together through the via array under the BGA, which means the via must be small enough to not only allow the diff pair to run together, but still space the traces far enough apart to attain the desired coupling. These traces also need to be the appropriate width in correlation to the thickness of the dielectrics and their material attributes to provide the desired impedance.
It depends on your priorities. The following stackups were analyzed for relative cost, route density, power integrity and signal integrity. The three are rated at the top with the priority given to route density with good power and signal integrity. 44 Chapter Three – HDI Stackups Stackup A Figure 3-12: Stackup A Stackup A Comments: • Total score = 13 • This is a great average of the variables and a good stackup if you are starting out with HDI. • The via models are simple and it won’t be difficult to find vendors who can fabricate them.
O If the board is over 28 layers, the dielectrics can be so thin that de-lamination can occur under the higher temperatures required for lead-free soldering. o Generally when using a few BGAs with less than 1500 pins and a 1mm pin-pitch, the breakout and routing of these devices is feasible using through vias. 28 Chapter Three – HDI Stackups o However, if you have a large number these on a single design, then the route density may force the layer count up high enough to limit the effectiveness of this stackup.