By Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)
This e-book discusses the clinical mechanism of copper electrodeposition and it is wide selection of functions. The e-book will hide every little thing from the fundamental basics to sensible functions. moreover, the booklet also will hide vital themes such as:
• ULSI wiring fabric dependent upon copper nanowiring
• revealed circuit forums
• Stacked semiconductors
• via Silicon through
• soft copper foil for Lithium-Ion battery electrodes
This e-book is perfect for nanotechnologists, pros, and practitioners.
Read or Download Copper Electrodeposition for Nanofabrication of Electronics Devices PDF
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Extra info for Copper Electrodeposition for Nanofabrication of Electronics Devices
J Electroanal Chem 284:403–412 27. Vogt MR, Lachenwitzer A, Magnussen OM, Behm RJ (1998) In-situ STM study of the initial stages of corrosion of Cu (100) electrodes in sulfuric and hydrochloric acid solution. Surf Sci 399:49–69 28. Moffat TP, Ou Yang LY (2010) Accelerator surface phase associated with super conformal Cu electrodeposition. J Electrochem Soc 157(4):D228–D241 29. Li WH, Wang Y, Ye JH, Li SFY (2001) In situ STM study of chloride adsorption on Cu (110) electrode in hydrochloric acid aqueous solution.
Only when Cl- and PEGs are present in the solution where Cu2+ is being reduced is strong inhibition observed. The film adsorbed on copper surfaces in the solution without Cu2+ would be evidently different in structure from the film formed during copper deposition. PEG is expected to be positively charged by H+ ions in acid solution, and adsorbed on negatively charged copper surface by Cl- adsorption. References 1. Kardos O, Durham HB, Tomson AJ, Arcilesi DA (1970) Electrodeposition of copper. USP 3542655 2.
1 mM Cl- by in-situ Ellipsometry. They found that PEG adsorption is clearly evident at potentials near or positive of the pzc for all metals only in the presence of Cl-. 2 V for Cu. 35 V, respectively. All the potentials are referred to SHE. They concluded that the presence of Cl- is a necessary and sufficient condition for PEG adsorption, and univalent ions such as Cu+ and Ag+ are unnecessary. Kelly et al. 8 M H2SO4 solution by QCM measurement. Doblhofer et al.  further demonstrated CuCl formation and dissolution in acid copper sulfate solution with a Cl- concentration of more than 2 mM by EQCM measurement, and showed that the inhibiting layer forms by reaction between the adsorbate-covered copper electrode and PEG.