Download Copper Electrodeposition for Nanofabrication of Electronics by Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale PDF

By Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)

This e-book discusses the clinical mechanism of copper electrodeposition and it is wide selection of functions. The e-book will hide every little thing from the fundamental basics to sensible functions. moreover, the booklet also will hide vital themes such as:

• ULSI wiring fabric dependent upon copper nanowiring
• revealed circuit forums
• Stacked semiconductors
• via Silicon through
• soft copper foil for Lithium-Ion battery electrodes

This e-book is perfect for nanotechnologists, pros, and practitioners.

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Extra info for Copper Electrodeposition for Nanofabrication of Electronics Devices

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J Electroanal Chem 284:403–412 27. Vogt MR, Lachenwitzer A, Magnussen OM, Behm RJ (1998) In-situ STM study of the initial stages of corrosion of Cu (100) electrodes in sulfuric and hydrochloric acid solution. Surf Sci 399:49–69 28. Moffat TP, Ou Yang LY (2010) Accelerator surface phase associated with super conformal Cu electrodeposition. J Electrochem Soc 157(4):D228–D241 29. Li WH, Wang Y, Ye JH, Li SFY (2001) In situ STM study of chloride adsorption on Cu (110) electrode in hydrochloric acid aqueous solution.

Only when Cl- and PEGs are present in the solution where Cu2+ is being reduced is strong inhibition observed. The film adsorbed on copper surfaces in the solution without Cu2+ would be evidently different in structure from the film formed during copper deposition. PEG is expected to be positively charged by H+ ions in acid solution, and adsorbed on negatively charged copper surface by Cl- adsorption. References 1. Kardos O, Durham HB, Tomson AJ, Arcilesi DA (1970) Electrodeposition of copper. USP 3542655 2.

1 mM Cl- by in-situ Ellipsometry. They found that PEG adsorption is clearly evident at potentials near or positive of the pzc for all metals only in the presence of Cl-. 2 V for Cu. 35 V, respectively. All the potentials are referred to SHE. They concluded that the presence of Cl- is a necessary and sufficient condition for PEG adsorption, and univalent ions such as Cu+ and Ag+ are unnecessary. Kelly et al. 8 M H2SO4 solution by QCM measurement. Doblhofer et al. [21] further demonstrated CuCl formation and dissolution in acid copper sulfate solution with a Cl- concentration of more than 2 mM by EQCM measurement, and showed that the inhibiting layer forms by reaction between the adsorbate-covered copper electrode and PEG.

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