Download Electronic Components and Technology by Stephen Sangwine PDF

By Stephen Sangwine

Such a lot introductory textbooks in electronics specialise in the speculation whereas leaving the sensible features to be lined in laboratory classes. notwithstanding, the earlier such concerns are brought, the higher capable scholars might be to incorporate such vital matters as parasitic results and reliability on the very earliest levels of layout. This philosophy has stored digital parts and expertise thriving for 2 decades,  Read more...

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5 A at 5 V and spaced 50 mm apart. 95 V plane 50 mm from the first board. 95 V? 7 × 10 –8 Ωm. Ignore any heating effects. indb 30 1/26/07 11:11:29 AM Integrated circuits 3 Objectives □ □ □ □ □ To emphasize the importance of integrated-circuit technology in electronic engineering. To describe the manufacturing processes used in integrated-circuit production from preparation of raw material to packaging and testing. To introduce handling precautions for semiconductor devices. To outline the range of custom integrated-circuit design methods from full-custom through gate arrays to programmable logic.

Most silicon for IC manufacture is made by the Czochralski process, in which a single crystal ingot is formed by slowly withdrawing a rotating seed crystal from a crucible of molten purified silicon. The crystal orientation of the silicon is determined by the orientation of the seed crystal and is carefully chosen and indicated by grinding a flat along one side of the ingot. The crystal orientation of the wafers cut from the ingot is important when the wafers are scribed and broken into chips, as cleavage occurs more ­easily along some crystal planes.

This reduces the chance of solder forming bridges between tracks. For the same reason, ICs should be laid out with their rows of pins across the direction of flow. If a board is to be assembled with automatic component insertion equipment, setting up the machine may be easier if all axial components are laid out on a common pitch and all integrated circuits are oriented in the same direction. Recommendations on PCB design are given in IEC 60326-3 (1991). Rework and repair The ease with which wire-wrapped joints can be remade is a distinctive feature of wire-wrap technology.

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