By Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
RF and Microwave Microelectronics Packaging offers the newest advancements in packaging for high-frequency electronics. it is going to attract training engineers within the digital packaging and high-frequency electronics fields and to educational researchers attracted to knowing best matters within the advertisement zone. It covers the newest advancements in thermal administration, electrical/RF/thermal-mechanical designs and simulations, packaging and processing tools in addition to different RF/MW packaging-related fields.
Bringing jointly years of expertise within the box, lead authors Ken Kuang, Franklin Kim and Sean Cahill have introduced jointly top engineers operating in electronics to discover the latest advancements of microelectronic packaging. RF and Microwave Microelectronics Packaging also:
- Presents equipment and strategies used for measuring and trying out of the digital fabrics properties.
- Engages in an in-depth dialogue of ceramic fabrics for RF/MW packaging.
- Offers numerical simulation tools and methods utilized in research of digital units and materials.
- Discusses thermal administration matters for RF/MW packaging.
- Creates a RF/Microwave Packaging Roadmap for transportable Devices.
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Extra info for RF and Microwave Microelectronics Packaging
High frequency systems demand small feature sizes such that micromachining technologies are natural alternatives. Previously, Tai et al. 04 dB/λ for a frequency range of 75–110 GHz . LeDuc et al. integrated superconductor-insulator-superconductor (SIS) tunnel junctions mounted on a nitride membrane with a bulk micromachined rectangular waveguide using wet etching of a (1 0 0)-silicon wafer. 8 dB per wavelength insertion loss was measured . Davies et al. have fabricated a reduced-height, air filled, surface-micromachined Wband rectangular waveguide.
Fuh et al. networks. Another major interest is the vehicular radar, which the 76–77 GHz band is allocated for forward-looking as well as rear short-range vehicular radars [6, 7]. Such radars are also called “adaptive cruise control” or “collision avoidance” radars, and would provide drivers useful warnings about obstacles in their path and therefore, would be an evolutionary step towards intelligent traffic systems. Also of interest is the 94-GHz band. It could be used for imaging or wireless communications.
Chapter 2 Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages Eric A. Sanjuan and Sean S. Cahill Abstract As integrated circuit speeds and bandwidth needs increase, low-cost packaging and interconnect technology continue to be challenges. , taking advantage of volume manufacturing processes). This work describes a low-cost plastic QFN package possible of meeting these needs. This package has low-loss, high-bandwidth and is based around microCoax interconnect technology. Since this package structure is broadband, it allows for a variety of chipsets to be assembled using the same process sequence and I/O configuration, thereby eliminating costly overhead.